Millimeter wave frequency data communication systems

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United States of America Patent

PATENT NO 9793603
APP PUB NO 20150002355A1
SERIAL NO

13929249

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Abstract

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A first module and a second module are formed on a complementary metal-oxide-semiconductor (CMOS) chip substrate. The first module is to serialize and de-serialize a data signal. The second module is to up-convert and down-convert the data signal to and from the first module. An antenna is coupled to the second module and integrated onto the CMOS chip substrate. The antenna is coupleable to a hollow metal waveguide (HMWG). The first and second modules are arranged for proximity to the antenna to avoid substantially degrading the data signal at millimeter wave frequencies in migrating the data signal between the first module and the antenna.

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Patent Owner(s)

Patent OwnerAddressTotal Patents
HEWLETT PACKARD ENTERPRISE DEVELOPMENT LPHOUSTON, TX8793

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Patent Info (Count) # Cites Year
 
FCI AMERICAS TECHNOLOGY LLC (1)
* 6960970 Waveguide and backplane systems with at least one mode suppression gap 3 2004
 
HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP (2)
7983519 Photonic connection and method for enhancing alignment accuracy thereof 1 2008
8202012 Electro-optical connector and methods for aligning 5 2008
 
INTEL CORPORATION (1)
* 7271680 Method, apparatus, and system for parallel plate mode radial pattern signaling 12 2005
 
SIKLU COMMUNICATION LTD. (1)
2012/0256,796 Compact millimeter-wave radio systems and methods 6 2012
 
TEXAS INSTRUMENTS INCORPORATED (1)
* 2011/0199,972 Wireless Chip-to-Chip Switching 5 2011
 
AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD. (1)
2012/0175,535 OPTICAL BACKPLANE HAVING AT LEAST ONE OPTICAL RELAY ELEMENT FOR RELAYING LIGHT FROM AN INPUT FACET OF THE BACKPLANE TO AN OUTPUT FACET OF THE BACKPLANE 1 2011
* Cited By Examiner

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