Encapsulated bulk acoustic wave (BAW) resonator device

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United States of America Patent

PATENT NO 9793877
SERIAL NO

14108668

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Abstract

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An electronic package includes a die mounted on a first substrate; a second substrate disposed over the first substrate; a pillar wall extending between a surface of the die and an opposing surface of the second substrate to provide separation between the die and the second substrate, the pillar wall extending about a perimeter bounding the die and enclosing a cavity between the first and second substrates; and an encapsulating layer disposed over the first and second substrates and around the pillar wall. Substantially none of the encapsulating layer ingresses into the cavity.

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Patent Owner(s)

  • AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Buccafusca, Osvaldo Fort Collins, US 24 360
Martin, Steve Fort Collins, US 73 679

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