Method of mounting semiconductor chips, semiconductor device obtained using the method, method of connecting semiconductor chips, three-dimensional structure in which wiring is provided on its surface, and method of producing the same

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United States of America Patent

PATENT NO 9795033
SERIAL NO

14096514

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Importance

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Abstract

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A three-dimensional structure in which a wiring is provided on a surface is provided. At least a part of the surface of the three-dimensional structure includes an insulating layer containing filler. A recessed gutter for wiring is provided on the surface of the three-dimensional structure, and at least a part of a wiring conductor is embedded in the recessed gutter for wiring.

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Patent Owner(s)

  • PANASONIC CORPORATION

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Fujiwara, Hiroaki Nara, JP 73 564
Yoshioka, Shingo Osaka, JP 44 259

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