Thermal interface materials with thin film or metallization

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United States of America Patent

PATENT NO 9795059
APP PUB NO 20130265721A1
SERIAL NO

13897625

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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According to various aspects, exemplary embodiments are provided of thermal interface material assemblies. In one exemplary embodiment, a thermal interface material assembly generally includes a thermal interface material having a first side and a second side and a dry material having a thickness of about 0.0001 inches or less. The dry material is disposed along at least a portion of the first side of the thermal interface material.

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Patent Owner(s)

  • LAIRD TECHNOLOGIES, INC.

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Bruzda, Karen Cleveland, US 9 104
Craig, Michael D Painesville, US 5 167
Strader, Jason L Cleveland, US 44 405
Wisniewski, Mark Mentor, US 16 535

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