Heat-curable composition, dry film, and printed wiring board
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United States of America Patent
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Oct 24, 2017
Grant Date -
Dec 22, 2016
app pub date -
Jun 27, 2014
filing date -
Jun 28, 2013
priority date (Note) -
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status (Latency Note)
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Abstract
An object of the present invention is to provide: a heat-curable composition capable of yielding a cured article in which crack generation during a heating-cooling cycle can be inhibited; a dry film thereof; and a printed wiring board comprising the cured article. The heat-curable composition is characterized by comprising a semisolid or a solid epoxy compound and a curing accelerator that is made miscible with the epoxy compound when heated at 130 to 220° C. The dry film comprises a resin layer formed from this heat-curable composition, and the printed wiring board comprises a cured article obtained from the heat-curable composition or the dry film.
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