Solder mask ink composition

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United States of America Patent

PATENT NO 9796864
SERIAL NO

14471893

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Abstract

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A solder mask ink composition is disclosed. The solder mask ink composition includes an epoxy resin; a solvent in an amount of at least 20% by weight relative to the total weight of the solder mask ink composition; and optionally a non-ionic surfactant. The ink composition has a viscosity that is less than 1000 cps at a shear rate of 10 s−1 and greater than 30 cps at a shear rate of 495 s−1 and a temperature of 25° C.

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Patent Owner(s)

  • XEROX CORPORATION

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Nerger, Bryan A Niagara Falls, CA 1 1
Wu, Yiliang Oakville, CA 296 2355

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