Maximizing potential good die per wafer, PGDW

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 9798228
SERIAL NO

14869416

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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Consistent with an example embodiment, there is a semiconductor wafer substrate comprising a plurality of integrated circuits formed in arrays of rows and columns on the wafer substrate. A plurality of integrated circuits are in arrays of rows and columns on the wafer substrate; the rows and the columns have a first width. First and second saw lanes separate the integrated circuits, the first saw lanes are arranged parallel and equidistant with one another in a first direction defined by rows, and the second saw lanes are arranged parallel and equidistant with one another in a second direction defined by the columns. A plurality of process modules (PM) are on the wafer substrate, the PM modules defined in an at least one additional row/column having a second width. The at least one additional row/column is parallel to the plurality of device die in one direction.

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Patent Owner(s)

  • NXP B.V.

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Cobussen, Hans Nijmegen, NL 1 2
de, Kok Laurentius Nijmegen, NL 1 2
Kamphuis, Tonny Nijmegen, NL 22 166
Scheucher, Heimo Gratkorn, AT 17 53

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