Apparatus and method for cleaning flat objects in a vertical orientation with pulsed liquid jet
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United States of America Patent
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Oct 24, 2017
Grant Date -
Aug 10, 2006
app pub date -
Nov 9, 2005
filing date -
Feb 7, 2005
priority date (Note) -
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Abstract
An apparatus for cleaning flat objects such as semiconductor wafers with a pulsed liquid jet emitted from a group of nozzles that may be installed on one or on both sides of the wafer installed in a vertically arranged rotating chuck. The apparatus is comprised of a series of individual processing units, such as a loading unit, cleaning units, drying unit, and an unloading unit arranged circumferentially around a universal industrial robot capable of reaching any of the units and transferring the wafers between the units. Drying is carried out in a horizontal position of the wafer and may combine spin-dry with chemical treatment for accelerating the drying process and for improving quality of the drying process. All units are located in a sealed enclosure with a controlled purity of the atmosphere inside the enclosure. Method of cleaning is also disclosed.
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