Compliant bipolar micro device transfer head with silicon electrodes

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United States of America Patent

PATENT NO 9799547
SERIAL NO

15616676

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Abstract

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A compliant bipolar micro device transfer head array and method of forming a compliant bipolar micro device transfer array from an SOI substrate are described. In an embodiment, a compliant bipolar micro device transfer head array includes a base substrate and a patterned silicon layer over the base substrate. The patterned silicon layer may include first and second silicon interconnects, and first and second arrays of silicon electrodes electrically connected with the first and second silicon interconnects and deflectable into one or more cavities between the base substrate and the silicon electrodes.

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Patent Owner(s)

  • APPLE INC.

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Bibl, Andreas Los Altos, US 264 11086
Golda, Dariusz Redwood City, US 44 1383

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