Package structures having height-adjusted molding members and methods of forming the same

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 9799615
SERIAL NO

15214466

Stats

ATTORNEY / AGENT: (SPONSORED)

Importance

Loading Importance Indicators... loading....

Abstract

See full text

Package structures and methods of forming the same are disclosed. A package structure includes a die, a molding member and a redistribution circuit structure. The die includes a semiconductor substrate, a connector and a passivation layer. The semiconductor substrate has a top surface. The connector is disposed over the top surface of the semiconductor substrate. The passivation layer is disposed over the top surface of the semiconductor substrate and exposes a portion of the connector. The molding member laterally surrounds the semiconductor substrate, wherein a top surface of the molding member is higher than the top surface of the semiconductor substrate and the molding member forms a hooking structure that embraces over an edge portion of the semiconductor substrate. The redistribution circuit structure extends over the passivation layer and the molding member, and is electrically connected to the connector.

Loading the Abstract Image... loading....

First Claim

See full text

Family

Loading Family data... loading....

Patent Owner(s)

  • TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.

International Classification(s)

  • [Classification Symbol]
  • [Patents Count]

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Huang, Chang-Pin Taoyuan, TW 36 156
Kuo, Hung-Yi Taipei, TW 155 684
Lai, Yu-Chia Miaoli County, TW 82 255
Liang, Shih-Wei Taichung, TW 79 618
Liu, Chung-Shi Hsinchu, TW 773 10176
Liu, Ren-Xuan Hsinchu, TW 3 9
Tsai, Hao-Yi Hsinchu, TW 439 2987
Tu, Hsien-Ming Hsinchu County, TW 34 146

Cited Art Landscape

Load Citation

Patent Citation Ranking

Forward Cite Landscape

Load Citation

Maintenance Fees

Fee Large entity fee small entity fee micro entity fee due date
7.5 Year Payment $3600.00 $1800.00 $900.00 Apr 24, 2025
11.5 Year Payment $7400.00 $3700.00 $1850.00 Apr 24, 2029
Fee Large entity fee small entity fee micro entity fee
Surcharge - 7.5 year - Late payment within 6 months $160.00 $80.00 $40.00
Surcharge - 11.5 year - Late payment within 6 months $160.00 $80.00 $40.00
Surcharge after expiration - Late payment is unavoidable $700.00 $350.00 $175.00
Surcharge after expiration - Late payment is unintentional $1,640.00 $820.00 $410.00