Wafer structure for electronic integrated circuit manufacturing

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United States of America Patent

PATENT NO 9799653
SERIAL NO

15181110

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Abstract

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A bonded wafer structure having a handle wafer, a device wafer, and an interface region with an abrupt transition between the conductivity profile of the device wafer and the handle wafer is used for making semiconductor devices. The improved doping profile of the bonded wafer structure is well suited for use in the manufacture of integrated circuits. The bonded wafer structure is especially suited for making radiation-hardened integrated circuits.

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Patent Owner(s)

Patent OwnerAddress
FRONTGRADE COLORADO SPRINGS LLC4350 CENTENNIAL BLVD COLORADO SPRINGS CO 80907-3486

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Benedetto, Joseph M Monument, US 10 40
Kerwin, David B Colorado Springs, US 17 101

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