Inductive component and package structure thereof
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United States of America Patent
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Oct 24, 2017
Issued Date -
N/A
app pub date -
Oct 5, 2016
filing date -
Oct 5, 2016
priority date (Note) -
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Abstract
An inductive component and package structure is provided, comprising a magnetic body having a top surface and a bottom surface, wherein a plurality of conductive through holes are formed from the top surface to the bottom surface of the magnetic body, and the plurality of conductive through holes are electrically connected via first conductive patterns disposed over the top surface of the magnetic body and second conductive patterns disposed over the bottom surface of the magnetic body so as to form at least one conductive path, each passing through a corresponding set of conductive through holes, wherein each of the at least one conductive path has two terminals and a corresponding inductance. At least one portion of a first electronic device is disposed in a first space, at least partially surrounded by the at least one conductive path.
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