High voltage transistor structure and method

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United States of America Patent

PATENT NO 9799766
SERIAL NO

13772115

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A high voltage transistor structure comprises a first double diffused region and a second double diffused region formed in a first well of a substrate, wherein the first and second double diffused regions are of the same conductivity as the substrate, a first drain/source region formed in the first double diffused region, a first gate electrode formed over the first well and a second drain/source region formed in the second double diffused region. The high voltage transistor structure further comprises a first spacer formed on a first side of the first gate electrode, wherein the first spacer is between the first drain/source region and the first gate electrode, a second spacer formed on a second side of the first gate electrode and a first oxide protection layer formed between the second drain/source region and the second spacer.

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Patent Owner(s)

  • TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chen, Jing-Ying Hsin-Chu, TW 11 23
Chen, Po-Yu Baoshan Township, TW 136 646
Huang, Wan-Hua Hsin-Chu, TW 10 36
Wu, Kuo-Ming Hsin-Chu, TW 132 835

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