Multilayer circuit board and method for manufacturing the same
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United States of America Patent
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Oct 24, 2017
Grant Date -
Nov 5, 2015
app pub date -
Apr 30, 2015
filing date -
May 1, 2014
priority date (Note) -
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status (Latency Note)
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Abstract
A method for manufacturing a multilayer circuit board includes: forming a first patterned conductive layer on a ceramic substrate, the first patterned conductive layer having a first circuit pattern and a first submount pattern; forming a second patterned conductive layer on the first patterned conductive layer, the second patterned conductive layer having a second circuit pattern and a second submount pattern; forming an insulating layer on the ceramic substrate; and forming a third patterned conductive layer on the insulating layer. The third patterned conductive layer having a third circuit pattern and a third submount pattern. The first, second and third submount patterns are stacked one above another.
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