Wafer scale packaging

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United States of America Patent

PATENT NO 9805966
SERIAL NO

14341314

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Abstract

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A method of wafer scale packaging acoustic resonator devices and an apparatus therefor. The method including providing a partially completed semiconductor substrate comprising a plurality of single crystal acoustic resonator devices, each having a first electrode member, a second electrode member, and an overlying passivation material. At least one of the devices to be configured with an external connection, a repassivation material overlying the passivation material, an under metal material overlying the repassivation material. Copper pillar interconnect structures are then configured overlying the electrode members, and solder bump structures are form overlying the copper pillar interconnect structures.

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Patent Owner(s)

Patent OwnerAddress
AKOUSTIS TECHNOLOGIES CORP9805-A NORTHCROSS CENTER COURT HUNTERSVILLE NC 28078

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Shealy, Jeffrey B Cornelius, US 124 1520

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