Co or Ni and Cu integration for small and large features in integrated circuits

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United States of America Patent

PATENT NO 9805976
SERIAL NO

14991712

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Abstract

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In one embodiment of the present disclosure, a method for depositing metal in a feature on a workpiece is provided. The method includes electrochemically depositing a second metal layer on a first metal layer on a workpiece having at least two features of two different sizes in a dielectric layer, wherein the second metal layer is a copper layer and wherein the first metal layer includes a metal selected from the group consisting of cobalt and nickel, wherein the first metal layer completely fills the smallest feature but does not completely fill the largest feature.

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Patent Owner(s)

  • APPLIED MATERIALS, INC.

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Emesh, Ismail T Sunnyvale, US 28 1245
Shaviv, Roey Palo Alto, US 69 1093

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