Packaging methods for semiconductor devices with encapsulant ring

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United States of America Patent

PATENT NO 9805997
SERIAL NO

14334433

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Abstract

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Packaging methods for semiconductor devices, and packaged semiconductor devices are disclosed. In some embodiments, a method of packaging a semiconductor device includes coupling a ring to a substrate, and coupling an integrated circuit die to the substrate within the ring. A molding material is disposed around the integrated circuit die within the ring.

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Patent Owner(s)

  • TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chang, Chien-Kuo Zhubei, TW 99 1175
Chen, Chin-Liang Kaohsiung, TW 97 607
Ho, Kuan-Lin Hsin-Chu, TW 57 265
Lin, Shih-Yen New Taipei, TW 47 255
Lin, Wei-Ting Taipei, TW 88 417
Liu, Yu-Chih Taipei, TW 46 332

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