Semiconductor device and manufacturing method of semiconductor device
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United States of America Patent
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Oct 31, 2017
Grant Date -
Jan 26, 2017
app pub date -
Jul 22, 2016
filing date -
Jul 24, 2015
priority date (Note) -
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status (Latency Note)
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Abstract
A bonding member is a member shaped in a sheet and made of electrically-insulating resin. A semiconductor module includes a heatsink and a cooler that are electrically insulated from each other by the bonding member. The bonding member includes a central portion and a peripheral portion. A heat conductivity in a normal direction of the central portion is greater than a heat conductivity in the normal direction of the peripheral portion. Further, a heat conductivity in a surface direction of the peripheral portion is greater than a heat conductivity in the surface direction of the central portion. Further, the heat conductivity in the normal direction of the central portion is greater than the heat conductivity in the surface direction of the central portion.
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