Semiconductor device manufacturing method
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United States of America Patent
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Oct 31, 2017
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N/A
app pub date -
Dec 4, 2016
filing date -
Jan 29, 2016
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Abstract
A semiconductor device manufacturing method which enhances the reliability of a semiconductor device. The method includes a step in which a source wire is connected with a semiconductor chip while jigs are pressed against a die pad. The jigs each have a first support portion with a first projection and a second support portion with a second projection. Using the jigs thus structured, the first projection is made to contact with a first point on the front surface of the die pad and then the second projection is made to contact with a second point on the front surface of the die pad located closer to a suspension lead than the first point.
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