Semiconductor packages including through mold ball connectors on elevated pads and methods of manufacturing the same
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United States of America Patent
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Oct 31, 2017
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N/A
app pub date -
Jan 30, 2017
filing date -
May 31, 2016
priority date (Note) -
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Abstract
A semiconductor package includes first bump pads on a first surface of an interconnection structure layer, elevated pads thicker than the first bump pads on the first surface of the interconnection structure layer, a first semiconductor device connected on the first bump pads, through mold ball connectors connected on the elevated pads, respectively, a molding layer disposed covering the first surface of the interconnection structure layer to expose a portion of each of the through mold ball connectors, outer connectors respectively attached to the through mold ball connectors, and a second semiconductor device on a second surface of the interconnection structure layer opposite to the molding layer.
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