High voltage device and method of fabricating the same
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United States of America Patent
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Oct 31, 2017
Issued Date -
N/A
app pub date -
May 4, 2017
filing date -
Feb 4, 2016
priority date (Note) -
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Abstract
A high voltage device includes a substrate, a first LDMOS transistor and a second LDMOS transistor disposed on the substrate. The first LDMOS transistor includes a first gate electrode disposed on the substrate. A first STI is embedded in the substrate and disposed at an edge of the first gate electrode and two first doping regions respectively disposed at one side of the first STI and one side of the first gate electrode. The second LDMOS transistor includes a second gate electrode disposed on the substrate. A second STI is embedded in the substrate and disposed at an edge of the second gate electrode. Two second doping regions are respectively disposed at one side of the second STI and one side of the second gate electrode, wherein the second STI is deeper than the first STI.
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