Semiconductor devices and methods for fabricating the same

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United States of America Patent

PATENT NO 9806168
SERIAL NO

14988867

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Abstract

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The inventive concept relates to a semiconductor device and a method for fabricating the same. The semiconductor device comprises active patterns protruding from a substrate, an interlayer dielectric layer disposed on the substrate and including grooves exposing the active patterns, and gate electrodes in the grooves. The grooves include a first groove having a first width and a second groove having a second width greater than the first width. The gate electrodes include a first gate electrode in the first groove, and a second gate electrode in the second groove. Each of the first and second gate electrodes includes a first work function conductive pattern on a bottom surface and sidewalls of corresponding one of the first and second grooves, and a second work function conductive pattern on the first work function conductive pattern.

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Patent Owner(s)

  • SAMSUNG ELECTRONICS CO., LTD.

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Jeon, Yong-Ho Hwaseong-si, KR 22 207
Kim, Dohyoung Hwaseong-si, KR 38 195
Lee, JinWook Seoul, KR 49 351
Myung, Sungwoo Seoul, KR 6 33
Oh, Jisoo Incheon, KR 6 174
Seong, GeumJung Seoul, KR 18 119

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