Mating backplane for high speed, high density electrical connector
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United States of America Patent
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Oct 31, 2017
Issued Date -
N/A
app pub date -
Nov 20, 2015
filing date -
Nov 21, 2014
priority date (Note) -
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Abstract
A printed circuit board includes a plurality of layers including attachment layers and routing layers; and via patterns formed in the plurality of layers, each of the via patterns including first and second signal vias forming a differential signal pair, the first and second signal vias extending through at least the attachment layers; ground vias extending through at least the attachment layers, the ground vias including ground conductors; and shadow vias located adjacent to each of the first and second signal vias, wherein the shadow vias are free of conductive material in the attachment layers. The printed circuit board may further include slot vias extending through the attachment layers and located between via patterns.
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