Method of mounting electronic component to circuit board

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United States of America Patent

PATENT NO 9807889
SERIAL NO

13953682

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Importance

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Abstract

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An method of mounting electronic component includes: providing a connecting layer between a wiring and an electronic component, the connecting layer including a conductive layer formed of a solder powder-containing resin composition containing thermosetting resin, solder powder, and a reducing agent and one or two layers of a thermoplastic resin layer formed of thermoplastic resin; and electrically connecting the electronic component to the wiring through the connecting layer.

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Patent Owner(s)

Patent OwnerAddress
SENJU METAL INDUSTRY CO LTDTOKYO 120-8555
OSAKA UNIVERSITYSUITA-SHI OSAKA 565-0871

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Fujimoto, Kozo Osaka, JP 4 67
Fukumoto, Shinji Osaka, JP 17 321
Inoue, Shu Nara-ken, JP 3 15
Kan, Takeshi Saitama-ken, JP 3 2
Matsushima, Michiya Osaka, JP 1 0
Sakamoto, Takeshi Tokyo, JP 289 3690
Ueshima, Minoru Tokyo, JP 40 315
Watanabe, Satoshi Saitama-ken, JP 523 4776

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