Adapter cooling apparatus and method for modular computing devices
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United States of America Patent
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Oct 31, 2017
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app pub date -
Nov 25, 2015
filing date -
Nov 25, 2015
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Abstract
Disclosed herein are apparatuses and methods for the cooling of electronic components of a COM-Express module using an adapter module to become VITA-59 compliant module. The adapter module operatively and thermally couple to a modular computing device, e.g., the COM-Express compliant module, configured with a conduction-cooled plate to provide an additional path for conducting thermal energy generated from integrated circuit components located on the modular computing device. The adapter module includes dimensions and thicknesses to form a spatial gap between an assembled system having the adapter module, the cooling plate, and the modular computing device and a cooling surface of an external heat sink to which the assembled system couples. The spatial gap relative to the cooling plate provides clearance for the adapter module to elastically deform such that the surfaces of the assembly contacts the heat sink when the assembled system is coupled thereto.
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