Metal plating apparatus and method using solenoid coil

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United States of America Patent

PATENT NO 9809897
SERIAL NO

13801081

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Abstract

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A metal plating apparatus includes a chemical bath chamber, an anode disposed at a bottom portion of the chemical bath chamber, and a cathode disposed at a top portion of the chemical bath chamber. A solenoid coil is disposed within the chemical bath chamber between the anode and the cathode. The solenoid coil is arranged to apply a magnetic field during a metal plating process in a direction from the anode to the cathode.

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Patent Owner(s)

  • TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chen, Hsili Tainan, TW 1 1
Lin, Kuan-Hsiao Daliao Township, TW 2 2
Yang, Chung-Yen Tainan, TW 41 423
Yang, Shao-Chien Taipei, TW 1 1

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