Semiconductor wafer device and manufacturing method thereof

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United States of America Patent

PATENT NO 9812346
SERIAL NO

14968573

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Abstract

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A method of manufacturing a semiconductor device comprises providing a carrier, disposing a plurality of dies over the carrier along a first direction and a second direction orthogonal to the first direction to arrange the plurality of dies in a plurality of rows, and shifting one of the plurality of rows along the first direction or the second direction in a predetermined distance.

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Patent Owner(s)

  • TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Hwang, Chien Ling Hsinchu, TW 114 2169
Jang, Bor-Ping Hsin-Chu County, TW 44 857
Liao, Hsin-Hung Taipei, TW 36 143
Lin, Yeong-Jyh Nantou County, TW 57 183

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