Semiconductor module and inverter device
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United States of America Patent
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Nov 7, 2017
Issued Date -
Jul 7, 2016
app pub date -
Jul 31, 2014
filing date -
Sep 4, 2013
priority date (Note) -
Published
status (Latency Note)
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Abstract
In a semiconductor module of the invention, a heat sink has a convex portion in which a convex plane has an area smaller than a joint area to the joint layer, a first stepped portion provided to an edge of the convex portion, a thickness of the heat sink in a portion corresponding to the first stepped portion being smaller than a thickness of the heat sink in a portion corresponding to the convex portion, and a second stepped portion provided to an edge of the first stepped portion, a thickness of the heat sink in a portion corresponding to the second stepped portion being further smaller than the thickness of the heat sink in the portion corresponding to the first stepped portion. The joint layer is joined by the convex portion and the first stepped portion of the heat sink.
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