INTEGRATED FAN-OUT PACKAGE AND METHOD OF FABRICATING THE SAME
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United States of America Patent
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Nov 7, 2017
Grant Date -
Nov 30, 2017
app pub date -
Jul 4, 2016
filing date -
May 31, 2016
priority date (Note) -
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status (Latency Note)
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Abstract
An integrated fan-out package is described. The integrated fan-out package comprises a first die and a second die arranged adjacent to each other. A molding compound encapsulates the first and second dies. A redistribution structure is disposed over the molding compound and on the first and second dies. The redistribution structure comprises a first connection structure electrically connected to the first die, a second connection structure electrically connected to the second die and an inter-dielectric layer located between the first and second connection structures and separating the first connection structure from the second connection structure. The ball pad is disposed on the redistribution structure and electrically connected with the first die or the second die. The bridge structure is disposed on the first connection structure and on the second connection structure and electrically connects the first die with the second die.
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