Electrical connection around a crackstop structure

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 9812404
APP PUB NO 20170194265A1
SERIAL NO

14984547

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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The disclosure generally relates to semiconductor structures and, more particularly, to electrical connections used with crackstop structures and methods of manufacture. The structure includes: a conductive material; a dielectric material formed over the conductive material; a non-corrosive conductive material in at least one opening of the dielectric material and in direct contact with the conductive material; a crackstop structure formed over the dielectric material; and at least one of wiring layer in contact with the non-corrosive conductive material.

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Patent Owner(s)

  • GLOBALFOUNDRIES INC.

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Borjemscaia, Natalia Wappingers Falls, US 3 5
Fitzsimmons, John A Poughkeepsie, US 114 1317
Shapiro, Michael J Austin, US 45 714

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