Chip module and method for forming the same
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United States of America Patent
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Nov 7, 2017
Issued Date -
N/A
app pub date -
Jan 13, 2016
filing date -
Jan 21, 2015
priority date (Note) -
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status (Latency Note)
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Abstract
A chip module is provided. The chip module includes a chip having an upper surface, a lower surface and a sidewall. The chip includes a signal pad region adjacent to the upper surface. A recess extends from the upper surface toward the lower surface along the sidewall of the chip. A redistribution layer is electrically connected to the signal pad region and extends into the recess. A circuit board is located between the upper surface and the lower surface and extends into the recess. A conducting structure is located in the recess and electrically connects the circuit board to the redistribution layer. A method for forming the chip module is also provided.
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