Bonding wire for semiconductor devices

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United States of America Patent

PATENT NO 9812421
SERIAL NO

15105707

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Abstract

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Provided is a bonding wire capable of reducing the occurrence of defective loops. The bonding wire includes: a core material which contains more than 50 mol % of a metal M; an intermediate layer which is formed over the surface of the core material and made of Ni, Pd, the metal M, and unavoidable impurities, and in which the concentration of the Ni is 15 to 80 mol %; and a coating layer formed over the intermediate layer and made of Ni, Pd and unavoidable impurities. The concentration of the Pd in the coating layer is 50 to 100 mol %. The metal M is Cu or Ag, and the concentration of Ni in the coating layer is lower than the concentration of Ni in the intermediate layer.

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Patent Owner(s)

Patent OwnerAddress
NIPPON STEEL CHEMICAL & MATERIAL CO LTD13-1 NIHONBASHI 1-CHOME CHUO-KU TOKYO 1030027 ?1030027

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Hagiwara, Yoshiaki Tokyo, JP 11 65
Oda, Daizo Saitama, JP 61 213
Oyamada, Tetsuya Tokyo, JP 29 29
Uno, Tomohiro Tokyo, JP 109 711

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