Process of forming an electronic device including a ball bond

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United States of America Patent

PATENT NO 9812424
SERIAL NO

15143797

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ATTORNEY / AGENT: (SPONSORED)

Importance

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Abstract

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A process of forming an electronic device includes providing a wire comprising a first ball at an end thereof, operating on the first ball to modify a surface of the first ball to form a modified surface, moving the first ball to a first location on a die, and bonding the first ball along the modified surface to the first location of the die. In an embodiment, the process further includes moving a bonding tool including the wire away from the die while the wire remains bonded to the die.

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Patent Owner(s)

  • SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Anderson, Harold G Chandler, US 6 19
Ngo, Cang Mesa, US 4 90

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