Package on-package method
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United States of America Patent
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Nov 7, 2017
Issued Date -
N/A
app pub date -
Oct 24, 2016
filing date -
Sep 25, 2014
priority date (Note) -
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status (Latency Note)
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Abstract
A method comprises forming a trench over a top surface of a metal structure of a bottom package, dispersing an epoxy flux material in the trench, mounting a top package on the bottom package, wherein a solder ball of the top package is in direct contact with the top surface of the metal structure and performing a reflow process to form a joint structure, wherein the joint structure comprises the solder ball of the top package coupled to the metal structure in the bottom package and an epoxy protection layer having a first edge in direct contact with a top surface of the bottom package and a second edge surrounding a lower portion of the solder ball.
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