Semiconductor device and fabricating method thereof

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United States of America Patent

PATENT NO 9812569
SERIAL NO

14224961

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Abstract

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A semiconductor device and a method of fabricating the semiconductor device are provided. The semiconductor device includes a substrate; a source/drain region having a first dopant in the substrate; a barrier layer having a second dopant formed around the source/drain region in the substrate. When a semiconductor device is scaled down, the doped profile in source/drain regions might affect the threshold voltage uniformity, the provided semiconductor device may improve the threshold voltage uniformity by the barrier layer to control the doped profile.

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Patent Owner(s)

  • TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chen, I-Chih Tainan, TW 41 120
Chen, Ying-Hao Tainan, TW 32 77
Huang, Chih-Mu Tainan, TW 60 207
Jeng, Jung-Chi Tainan, TW 33 62
Kuo, Wen-Chang Tainan, TW 42 172
Wang, Ying-Lang Taichung, TW 180 1220

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