Microphone package
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United States of America Patent
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-
Nov 7, 2017
Issued Date -
N/A
app pub date -
Jan 26, 2017
filing date -
Oct 25, 2016
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A microphone package includes a housing; a control circuit chip accommodated in the housing; a micro-electromechanical chip accommodated in the housing; and a circuit board forming an accommodation space with the housing. The circuit board includes a substrate, a rigid conductive layer disposed on the substrate and a plurality of conductive pads on the substrate for connecting to the control circuit chip. The micro-electromechanical chip and the control circuit chip are mounted on the rigid conductive layer, and the rigid conductive layer is provided with a number of isolation holes for receiving the conductive pads.
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