Electronic devices wire bonded to substrate through an adhesive layer and method of making the same
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United States of America Patent
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Nov 7, 2017
Issued Date -
N/A
app pub date -
Jun 24, 2015
filing date -
Jun 24, 2015
priority date (Note) -
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status (Latency Note)
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Abstract
A disclosed circuit arrangement includes a substrate having first bond pads coupled to a pattern of conductors. The first bond pads and the pattern of conductors are disposed on a first surface of the substrate. A first layer of adhesive is directly disposed on the first surface of the substrate and the pattern of conductors and has openings at the first bond pads. An electronic device has opposing first and second surfaces and is attached to the first surface of the substrate by the first surface of the electronic device in contact with the first layer of adhesive. The second surface of the electronic device has second bond pads. Bond wires are connected at the first bond pads through the openings in the first layer of adhesive and connected at the second bond pads.
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