Control of electrolyte flow dynamics for uniform electroplating

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United States of America Patent

PATENT NO 9816194
SERIAL NO

14662823

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Abstract

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The uniformity of electroplating a metal (e.g., copper) on a semiconductor wafer is improved by using an electroplating apparatus having a flow-shaping element positioned in the proximity of the semiconductor wafer, wherein the flow-shaping element is made of a resistive material and has two types of non-communicating channels made through the resistive material, such that the electrolyte is transported towards the substrate through both types of channels. The first type of channels is not perpendicular to the plane defined by a plating face of the substrate. The second type of channels is perpendicular to the plane defined by the plating face of the substrate. The channels of the first and second type are substantially spatially segregated. In one embodiment a plurality of channels of the first type are located in the central portion of the flow-shaping element and are surrounded by a plurality of channels of the second type.

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Patent Owner(s)

  • LAM RESEARCH CORPORATION

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Feng, Jingbin Lake Oswego, US 33 764
Ghongadi, Shantinath Tigard, US 47 505
He, Zhian Lake Oswego, US 41 818
Reid, Jonathan D Sherwood, US 69 2613
Zhou, Jian West Linn, US 382 3253

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