Substrate treatment apparatus

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United States of America Patent

PATENT NO 9818572
SERIAL NO

14020669

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Abstract

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A substrate treatment apparatus includes a chamber providing a reaction region and including first and second sides facing each other, a module connected to the first side, an upper electrode in the reaction region, a substrate holder facing the upper electrode, wherein a substrate is disposed on the substrate holder, and first and second points are defined on the substrate, wherein the first point corresponds to a center of the substrate, and the second point is distant from the first point toward the first side, and a feeding line for applying an RF power, the feeding line connected to the upper electrode corresponding to the second point.

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Patent Owner(s)

Patent OwnerAddress
JUSUNG ENGINEERING CO LTDGYEONGGI DO SOUTH KOREA GYEONGGI-DO

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Kang, Ho Chul Gwangju-si, KR 15 40

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