Multi-layer polishing pad for CMP

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United States of America Patent

PATENT NO 9818618
SERIAL NO

14700580

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Abstract

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The invention is directed to a multi-layer polishing pad for chemical-mechanical polishing comprising a top layer, a middle layer and a bottom layer, wherein the top layer and bottom layer are joined together by the middle layer, and without the use of an adhesive. The invention is also directed to a multi-layer polishing pad comprising an optically transmissive region, wherein the layers of the multi-layer polishing pad are joined together without the use of an adhesive.

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Patent Owner(s)

  • CABOT MICROELECTRONICS CORPORATION

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Blake, Garrett Naperville, US 1 0
Mrzyglod, Brian Elburn, US 1 0
Nair, Jayakrishnan Naperville, US 4 29

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