Semiconductor modules and methods of forming the same

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United States of America Patent

PATENT NO 9818686
SERIAL NO

15138681

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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Electronic modules, and methods of forming and operating modules, are described. The modules include a capacitor, a first switching device, and a second switching device. The electronic modules further include a substrate such as a DBC substrate, which includes an insulating layer between a first metal layer and a second metal layer, and may include multiple layers of DBC substrates stacked over one another. The first metal layer includes a first portion and a second portion isolated from one another by a trench formed through the first metal layer between the two portions. The first and second switching devices are over the first metal layer, a first terminal of the capacitor is electrically connected to the first portion of the first metal layer, and a second terminal of the capacitor is electrically connected to the second portion of the first metal layer, with the capacitor extending over the trench.

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Patent Owner(s)

  • TRANSPHORM INC.

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Wu, Yifeng Goleta, US 154 6517
Yea, Sung Hae La Canada, US 5 36

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