Semi-finished product for the production of a printed circuit board and method for producing the same
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United States of America Patent
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Nov 14, 2017
Issued Date -
N/A
app pub date -
Dec 20, 2013
filing date -
Dec 31, 2012
priority date (Note) -
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status (Latency Note)
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Abstract
In a semi-finished product for the production of a printed circuit board with at least one recessed electronic component having at least one conductive layer structured to provide a connector pad for an electronic component, fan-out lines connected to the connector pad and further to provide at least one laser-stop device encompassing the connector pad, wherein the laser-stop device has at least one passage for passing-through the fan-out lines, the semi-finished product further comprises at least one cap layer applied to the conductive layer, the at least one cap layer having an opening in registration with each passage. The inventive method for producing a printed circuit board with at least one recessed component, is characterized by the steps of providing at least one conductive layer, structuring said conductive layer to provide a connector pad for an electronic component, fan-out lines connected to the connector pad and further to provide at least one laser-stop device encompassing the connector pad, leaving at least one passage in the laser-stop device for passing-through the fan-out lines, and applying a cap layer to said conductive layer, the cap layer having an opening in registration with each passage.
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