Stacked-die MEMS resonator system

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United States of America Patent

PATENT NO 9821998
SERIAL NO

15187748

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Abstract

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In a microelectromechanical system (MEMS) device, a CMOS die is affixed to a die-mounting surface and wire-bonded to electrically conductive leads, and a MEMS die is stacked on and electrically coupled to the CMOS die in a flip-chip configuration. A package enclosure envelopes the MEMS die, CMOS die and wire bonds, and exposes respective regions of the electrically conductive leads.

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Patent Owner(s)

  • SITIME CORPORATION;SITIME CORPOARATION

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Gupta, Pavan Belmont, US 37 266
Lutz, Markus Mountain View, US 159 3781
Partridge, Aaron Cupertino, US 143 2450

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