Substrate processing apparatus, substrate processing method and storage medium storing substrate processing program

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 9822453
APP PUB NO 20150159276A1
SERIAL NO

14560332

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Abstract

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A substrate entire region treatment process of discharging a processing fluid of a temperature different from a surface temperature of a substrate 3 from a first nozzle 24 toward the substrate is performed while moving the first nozzle toward an outer side from an entire region treatment start position P2 located at a central portion to an entire region treatment end position P5 located at a peripheral portion. Then, after moving the first nozzle toward an inner side to a peripheral region treatment start position P6 located at an outer position than the entire region treatment start position P2, a substrate peripheral region treatment process of discharging the processing fluid from the first nozzle toward the substrate is performed while moving the first nozzle toward the outer side from the peripheral region treatment start position P6 to a peripheral region treatment stop position P7 located at a peripheral portion.

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Patent Owner(s)

  • TOKYO ELECTRON LIMITED

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Kaneko, Satoshi Koshi, JP 225 2374
Motomatsu, Kazuki Koshi, JP 8 4
Sakamoto, Kazunori Koshi, JP 55 529

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