Automated application of cut thermal adhesive films
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United States of America Patent
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Nov 21, 2017
Issued Date -
N/A
app pub date -
Mar 27, 2015
filing date -
Mar 28, 2014
priority date (Note) -
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status (Latency Note)
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Abstract
A system and method for causing a specialized device to cut and weed a cut thermal transfer film is provided. In an embodiment, a service provider computer receives a request for one or more designs to be attached to a substrate. The service provider computer uses the design to generate additional instructions for a thermal transfer film cutting device that describe regions of the thermal transfer film to be cut to create the one or more designs, regions of the thermal transfer film to be cut to provide a registration means, and regions of the thermal transfer film to be attached to a receiving sheet. The service provider computer sends the additional instructions to the thermal transfer film cutting device which executes the instructions on a thermal transfer film.
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