Method and apparatus for controlling spatial temperature distribution
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United States of America Patent
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Nov 21, 2017
Grant Date -
Jul 2, 2015
app pub date -
Jan 12, 2015
filing date -
Apr 30, 2001
priority date (Note) -
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status (Latency Note)
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Abstract
A chuck for a plasma processor comprises a temperature-controlled base, a thermal insulator, a flat support, and a heater. The temperature-controlled base is controlled in operation a temperature below the desired temperature of a workpiece. The thermal insulator is disposed over at least a portion of the temperature-controlled base. The flat support holds a workpiece and is disposed over the thermal insulator. A heater is embedded within the flat support and/or mounted to an underside of the flat support. The heater includes a plurality of heating elements that heat a plurality of corresponding heating zones. The power supplied and/or temperature of each heating element is controlled independently. The heater and flat support have a combined temperature rate change of at least 1° C. per second.
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