Light-emitting diode packaging element for controlling color temperature of lights
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United States of America Patent
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Nov 21, 2017
Grant Date -
Sep 29, 2016
app pub date -
Mar 15, 2016
filing date -
Mar 26, 2015
priority date (Note) -
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Abstract
A light-emitting diode package element includes a substrate, a plurality of light-emitting dies arranged on the substrate, and a second wavelength-conversion layer. Some of the light-emitting dies are covered with first wavelength-conversion layers thereon, respectively. The first wavelength-conversion layers convert into light with a first color temperature. The second wavelength-conversion layer covers the substrate, the light-emitting dies, and the first wavelength-conversion layers, and converts into light with second color temperature different to the light with the first color temperature.
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