Method of glass fabric production including resin adhesion for printed circuit board formation

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United States of America Patent

PATENT NO 9827590
APP PUB NO 20160368820A1
SERIAL NO

14824839

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Abstract

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Embodiments generally relate to devices and methods for production of fibers and threads for use in electronic device manufacturing. Described here, fibers can be produced and manipulated using a dual-surfaced sizing material. The dual-surfaced sizing material has a surface which binds a fiber and a surface which binds a resin. Thus, the dual-surfaced sizing material can be left attached to the fibers without adversely affecting the resin binding in later production steps.

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Patent Owner(s)

Patent OwnerAddress
INTERNATIONAL BUSINESS MACHINES CORPORATIONNEW ORCHARD ROAD ARMONK NY 10504

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Czaplewski, Sarah K Rochester, US 126 271
Kuczynski, Joseph North Port, US 573 2251
Wertz, Jason Pleasant Valley, US 4 7
Zhang, Jing Poughkeepsie, US 966 8974

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