Cleaning composition and method for cleaning semiconductor wafers after CMP

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United States of America Patent

PATENT NO 9828574
SERIAL NO

14993837

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Abstract

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The invention provides a composition for cleaning contaminants from semiconductor wafers following chemical-mechanical polishing. The cleaning composition contains one or more quaternary ammonium hydroxides, one or more organic amines, one or more metal inhibitors, and water. The invention also provides methods for using the cleaning composition.

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Patent Owner(s)

  • CABOT MICROELECTRONICS CORPORATION

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Hung, Fernando Aurora, US 1 4
Ivanov, Roman Aurora, US 16 397
Ko, Cheng-Yuan New Taipei, TW 11 19
Sun, Fred Naperville, US 6 37

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