Air cavity package
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United States of America Patent
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Nov 28, 2017
Issued Date -
N/A
app pub date -
Sep 1, 2016
filing date -
Sep 1, 2015
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A leadframe and air cavity packages formed using the leadframe are described. Using the leadframe, several air cavity packages can be quickly formed at one time. Further, electrical components can be placed within and interconnected with the air cavity packages easily by repositioning several devices at a time using the leadframe. After assembly, the air cavity packages can be separated from the leadframe. The air cavity packages can include a slug, a plastic frame that surrounds the slug and forms an air cavity, and a cover that encloses the air cavity. The air cavity package further includes one or more conductive leads of the leadframe that extend through the plastic frame and are exposed within the air cavity. The conductive leads can be relied upon to bond out components secured within the air cavity. Finally, the cover can be secured to enclose the air cavity.
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